The STM32WB30CE multiprotocol wireless and ultra-low-power MCU embeds a powerful and ultra-low-power radio compliant with the Bluetooth® Low Energy SIG specification v5.0 or with IEEE 802.15.4-2011.

https://www.futureelectronics.com/resources/featured-products/stmicroelectronics-stm32wb30-microcontroller

The MCP16501 is a cost and size optimized integrated PMIC, compatible with the latest Microchip’s Microprocessor Units (MPU) and associated DRAM Memories. The SAMA5, SAM9X60 and SAMA7G54 series MPUs are supported by dedicated PMIC variants programmed for the different supply voltages and power sequencing requirements.

https://www.futureelectronics.com/npi/microchip-mcp16501-pmic

The high-voltage, high-speed 6ED2230S12T IGBT includes three independent high side and low side referenced output channels for three phase applications. This Infineon gate driver’s proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. The 6ED2230S12T’s logic input is compatible with standard CMOS or TTL outputs, down to 3.3 V logic, while an over‐current protection (OCP) function terminates all six outputs and can also be derived from this resistor.

https://www.futureelectronics.com/npi/infineon-6ed2230s12t-three-phase-gate-driver

The i.MX RT1170 crossover MCUs are setting speed records at 1 GHz. This ground-breaking family combines superior computing power and multiple media capabilities with ease of use and real-time functionality.

https://www.futureelectronics.com/npi/nxp-imx-rt1170-crossover-mcu

The Microchip MCP3461R (MCP3561R) is a low-noise 16(24)-bit Delta-Sigma Analog-to-Digital Converter (ADC), with two single-ended or one differential input channels and programmable data rate of up to 153.6 kSPS. The ADC converters offer integrated features such as internal Vref, an oscillator, temperature sensor and burnout sensor detection, to reduce system component count and total solution cost.

https://www.futureelectronics.com/npi/microchip-mcp3461r-mcp3561r-adc

The u-blox SARA-R5 series modules are based on the UBX-R5 cellular chipset and the u blox M8 GNSS receiver chip. By bringing all technology building blocks in house and having full hardware and software ownership, u blox can guarantee long-term device availability and provide lifetime support of the entire platform, down to the chipset level.

https://www.futureelectronics.com/npi/u-blox-sara-r5-series-lte-m-module

The STMicroelectronics IIS2ICLX has an unmatched set of embedded features (programmable FSM, Machine Learning Core mentioned above, sensor hub, FIFO, event decoding and interrupts) which are enablers for implementing smart and complex sensor nodes that deliver high accuracy and performance at exceptionally low power.

https://www.futureelectronics.com/npi/stmicroelectronics-iis2iclx-2-axis-digital-inclinometer

Laird Connectivity’s latest range of Nordic nRF52833 based modules specifically targets OEMs where space is constrained in their designs. Yet still the miniaturized BL653μ series enables Industrial OEMs to robustly implement longer range Bluetooth LE applications in the harshest operating environments.

https://www.futureelectronics.com/npi/laird-connectivity-bl653u-bluetooth-nfc-modules

Powered by Infineon’s CYW4373E silicon, the Sterling-LWB5+ is purpose-built for IoT connectivity through a secure, reliable, and robust feature set. The Sterling-LWB5+ is innovative IoT from the start: fully certified, easy to integrate, and is the fastest route to the market for IoT.

https://www.futureelectronics.com/npi/laird-connectivity-sterling-lwb5-wifi-bluetooth-modules

A complete selection of sensors including Accelerometer, Angular Position, Gyro, Humidity / Dew, Linear Position, Magnetic / Hall Effect, Motion, Pressure, Proximity and Temperature that can be used for all kinds of sensing applications for circuits.

https://www.futureelectronics.com/c/semiconductors/analog--sensors--time-off-flight-sensors/products